Robomart Tqfp 32 To Dip 28 Prototyping Board

DIP: - In microelectronics, a dual in-line package (DIP), sometimes called a DIL-package (for Dual In Line-package),[1] is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board(PCB), i.e. to pass through holes on the PCB and be soldered on the other side. DIP is sometimes incorrectly considered to stand for dual in-line pin, in an effort to justify the redundant term "DIP package" (Dual in-line pin would imply one line of two pins). Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device(s), and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description (with bent leads at the sides.) A DIP is usually referred to as a DIPn, where n is the total number of pins.